【Published】Highly Reliable Four-Point Bending Test Using Stealth Dicing Method for Adhesion Evaluation

【Published】Highly Reliable Four-Point Bending Test Using Stealth Dicing Method for Adhesion Evaluation

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IIR Laboratory for Future Interdisciplinary Research of Science and Technology/Dr.Takayuki Ohba and Dr. Kuan-Neng Chen published in 2019 International Conference on Electronics Packaging (ICEP) .

Authors:

Yi-Lun Yang, Jia-Ling Liu, Guan Wei Chen, Shoichi Kodama, Kyosuke Kobinata,　Kuan-Neng Chen, Hiroyuki Ito, Young Suk Kim, Takayuki Ohba
DOI: 10.23919/ICEP.2019.8733422