Chen Kuan-Neng

研究プロジェクト

2000 - 2005	Ph.D., Dept. EECS, MIT
2005 - 2009	Research Staff Member, IBM TJ Watson Research Center
2009 - 2012	Associate Professor, Dept. Electronics Engineering, NCTU
2012 -	Professor, Dept. Electronics Engineering, NCTU
2015 -	Vice Dean, Intl College of Semiconductor Technology, NCTU
2016 -	R&D Director, ITRI
2017-	Specially Appointed Professor, Tokyo Institute of Technology
2018-	Micron Chair Professor
2018-	Distinguished Professor, NCTU
2019-	Vice President, International Affairs, NCTU

2010	Outstanding Youth Award, Electronics Devices and Materials Association (EDMA), 2010 Young Professor Award, Adventech, 2010
2011	NCTU Distinguished Faculty Award, since 2011 every year NCTU Outstanding Industry-Academia Cooperation Achievement Award
2012	Outstanding Youth Award, Chinese Institute of Electrical Engineering (CIEE) NCTU Outstanding Industry-Academia Cooperation Achievement Award
2014	Outstanding Professor Award, Chinese Institute of Electrical Engineering (CIEE), 2014 Outstanding Service Award, Electronics Devices and Materials Association (EDMA), 2014 NCTU Outstanding Industry-Academia Cooperation Achievement Award
2018	IEEE Fellow, 2018 “for contributions to 3D integrated circuit and packaging technologies”
2018	IEEE EPS Exceptional Technical Achievement Award, IEEE Electronics Packaging Society, 2018. “For contributions to 2.5D and 3D IC heterogeneous integration, with focus on interconnect technologies.”
2018	MOST Outstanding Research Award, Ministry of Science and Technology, 2018.

2013	“Through-Silicon-Via Based Double-Side Integrated Microsystem for Neural Sensing Applications”, ISSCC, 2013..
2014	“2.5D Heterogeneously Integrated Bio-Sensing Microsystem for Multi-Channel Neural Sensing Applications,” ISSCC,
2016	“An Advanced 3D/2.5D Integration Packaging Approach Using Double-Self-Assembly Method with Complex Topography, and Micropin-Fin Heat Sink Interposer for Pressure Sensing System”, IEDM, 2016 “Integration of Neural Sensing Microsystem with TSV-embedded Dissolvable µ-Needles Array, Biocompatible Flexible Interposer, and Neural Recording Circuits”, VLSI, 2016.
2018	“Location-controlled-grain Technique for Monolithic 3D BEOL FinFET Circuits”, IEDM, 2018.