Three-Dimensional Semiconductor Process Integration／International Project for Heterogeneous and Functional Integration

In this project, we will characterize bonding materials to ensure high-reliability interconnects by evaluating the mechanical characteristics of the bonding materials in stack process and the electrical characteristics of vertical interconnects. Since circuit design (which can be thought of as the floor plan of the device) is derived from conventional planar scaling, it is possible to increase bandwidth fan-out and reduce power consumption in 3D devices through the use of high-density short interconnects without bumps in stack devices. Based on these technologies, it will become possible to manufacture ultra-small systems 1000 times smaller than current technologies comprising terabyte storage memory and microprocessor capabilities.

Assessment of RC shear walls under seismic loading

Slender reinforced concrete walls are an important part of a building’s lateral load resisting systems. The 1999 Standard for Structural Calculation of Reinforced Concrete Structures [2] mandated the use of structural walls with boundary columns. In 2010, the standard was revised to allow structural walls with rectangular cross sections for buildings higher than five stories. To avoid catastrophic failure, structural walls are normally designed to have high shear resistance relative to flexural resistance and consequently fail in a ductile flexural mode.

Japan-Germany Joint Research Platform for Development of Selective Precipitants for Nuclear Fuel Materials

Development of Simple and Versatile Nuclear Fuel Recycling Technology Based on Genuine Actinide Chemistry

Actinide ChemistryNuclear Energy SystemNuclear Fuel Recycling